Thermal fluid analysis software(care) - List of Manufacturers, Suppliers, Companies and Products

Thermal fluid analysis software "e-flowDX"

Simulation program for moving boundary problems and free surface problems.

◆Moving Boundary Problem: It is possible to move multiple objects independently and arbitrarily. The analysis of moving boundary problems, such as the movement of complex objects, opening and closing doors, and rotating machinery, which was essentially impossible in unstructured grids, can now be easily performed. It is also possible to feedback the fluid forces acting on the objects into their motion. ● Changes in degrees of freedom such as axial movement and rotation around each coordinate axis can be achieved through simple motion definitions. ● Analysis is possible not only for solid structures with volume but also for thin structures (shells) without thickness. ● Various conditions can be assigned to moving objects, such as heat transfer and mass transfer boundaries, as well as free surface flows. ● The situation of time-varying flow fields can be animated along with the movement of moving objects for detailed examination. ◆ e-flowDX Tsunami Load Analysis Version In response to the unprecedented damage caused by the Great East Japan Earthquake and the resulting tsunami, there has arisen a necessity for simulations that were not part of previous settings. Specifically, the evaluation of tsunami loads from waves as high as 10 to 20 meters and the assessment of tsunami loads on groups of buildings are now considered essential and urgent for the design of facilities built along the coast, not just for evacuation buildings, but also for urban planning.

Company：環境シミュレーション
Price：Other

Contract Analysis
Thermo-fluid analysis
simulator

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Thermal fluid analysis software [Quickly analyze the thermal performance of electronic devices!]

Top-class solver in the industry! You can work without worrying about raw 3D CAD shapes.

The "Celsius EC Solver" is a thermal fluid analysis software designed to analyze the thermal performance of electronic devices with high precision and speed. It employs powerful solvers and grid generation techniques, allowing designers to model and analyze complex electronic devices, reducing the risk of failure, and optimizing thermal solutions to maximize performance. It can analyze not only the airflow, temperature, and heat conduction within electronic device assemblies and enclosures, but also natural convection, forced convection, solar radiation, and liquid cooling. 【Features】 ■ Capable of addressing thermal and cooling issues of electronic devices in the early stages of design ■ Proactively mitigates costly design revisions and manufacturing delays ■ Enhances product performance and reliability ■ Scalable to hundreds of cores, accommodating complex systems *For more details, please refer to the PDF document or feel free to contact us.